Home Cyclone Robotics Has Completed the Largest-Ever Individual Financing Round in China’s RPA Industry

Cyclone Robotics Has Completed the Largest-Ever Individual Financing Round in China’s RPA Industry

by sol-admin

Founded in 2015, Cyclone Robotics is a well-known RPA software and solution provider in China. In 2021, Cyclone was selected as a representative company in Gartner’s Magic Quadrant and Strong Performer in Forrester Wave. The company is headquartered in Shanghai, and currently has branches and offices in over ten foreign and domestic cities, including Beijing, Shenzhen, Chengdu, Nanjing, Hangzhou, Wuxi, Xi’an, and Singapore, and has established an R&D center in Silicon Valley, USA. Yesterday, the company announced the completion of a US$150 million Round C financing which is the largest-ever individual financing round in China’s RPA industry. Let’s look at the details.

This round was led by CMC Capital and Goldman Sachs Asset Management, with Lavender Hill Capital Partners, ZWC Partners, V Fund, DCM, Matrix Partners, and Source Code Capital acting as co-investors. According to Cyclone Robotics, after this round of financing, it will continue to bolster its hyper-automation product capabilities and technical strength, with an objective to expand its customer coverage, ranging from small- and medium-sized enterprises. It also endeavors to strengthen its global network and collaborative partnership ecosystem.

Cyclone RPA, which is powered by cutting-edge technologies like AI, NLP, and others, is a proprietary product independently developed by Cyclone Robotics, aiming to automate customers’ specific business processes. According to its website and LinkedIn account, the company spends more than 100 million yuan ($15.67 million) on product R&D every year. The founders of the company are early practitioners in the domestic intelligent automation industry, and most of its team members previously worked in domestic and foreign Internet and technology companies such as HP, IBM, Microsoft, Alibaba, and iFlytek.